Vanichchinchai, Assadej, and Wanwisa Duantrakoonsil. “Quality Improvement of Printed Circuit Board: A Case Study of Copper in Hole”. Science, Engineering and Health Studies 12, no. 2 (August 31, 2018): 77–84. Accessed May 4, 2024. https://li01.tci-thaijo.org/index.php/sehs/article/view/143461.