Growth and Yields of Derris elliptica Benth. Planting at the Three Places

Authors

  • Siripan Srijugawan Biotechnology Research and Development Office, Department of Agriculture
  • Paanika Attanon Agricultural Resources Research and Development Office, Department of Agriculture
  • Somporn Suriyant Biotechnology Research and Development Office, Department of Agriculture, Chatuchak, Bangkok 10900
  • Supinya Boonmanop Biotechnology Research and Development Office, Department of Agriculture, Chatuchak, Bangkok 10900
  • Pramote Kerdsiri Kerdsiri Biotechnology Research and Development Office, Department of Agriculture, Chatuchak, Bangkok 10900

DOI:

https://doi.org/10.14456/thaidoa-agres.2004.9

Keywords:

Derris growth, yield, fertilizer rotenone

Abstract

Study on growth and yields of Derris elliptica Benth. at the three places namely Chantaburi, Petchaburi and Chumphon provinces during June 2000- 2002. The randomized complete block design with 4 replications and 3 treatments were imployed in each place. The results were concluded that : 1) the rotenone percentage at the Chantaburi in the green manure and the chemical fertilizing plots were 4.76 and 4.75 % which were significantly different from the check (3.73%),2) the rotenone percentage at the all treatments in Petchaburi and Chumphon showed no significantly different.3) The average of the rotenone percentage were 4.42 at Chantaburi, 3.41 at Chantaburi, 3.41 at Chumphon and 3.17 at Petchaburi and 4) The average yield were 596.81 393.35 and 345.01 kg/rai at Chantaburi, Chumphon and Petchaburi and Chumphon were 5.80, 4.98 and 5.03 kg/plant and 6) the average of Derris’s base of stem diameter at Chantaburi, Petchaburi and Chumphon were 4.69, 4.15 and 4.71 cm respectively.

Published

2004-08-28

How to Cite

Srijugawan, S., Attanon, P., Suriyant, S. ., Boonmanop, S. ., & Kerdsiri , P. K. . (2004). Growth and Yields of Derris elliptica Benth. Planting at the Three Places. Thai Agricultural Research Journal, 22(2), 119–127. https://doi.org/10.14456/thaidoa-agres.2004.9

Issue

Section

Technical or research paper