THE EFFECT OF N2 FLOW RATE TO PROPERTY OF (Cr-Al-Nb-Si-V)N FILM BY SPUTTERING TECHNIQUE

Authors

  • Wuttichai Phae-ngam Phranakhon Rajabhat University
  • Natthapong Wongdamnern Faculty of Science and Technology, Rajamangala University of Technology Suvarnabhumi
  • Tanapoj Chaikeeree King Mongkut's University of Technology Thonburi
  • Tossaporn Lertvanithphol National Electronics and Computer Technology Center
  • Mati Horprathum National Electronics and Computer Technology Center

Keywords:

Nitride film, Metallic glass film, Sputtering

Abstract

This research aimed to study the chemical and physical properties of (Cr-Al-Nb-Si-V)N films deposited with varying nitrogen gas flow rates ranging from 0 to 5 sccm using the sputtering method. The results indicated that the nitrogen gas flow rate significantly affects the film’s morphology and crystal structure. At 0 sccm nitrogen gas flow rate, the film’s surface was smooth and the crystal structure exhibited an amorphous. However, when the nitrogen gas flow rate is increased to 1-5 sccm, the film surface shows obvious grains with sizes ranging from 16.6±2.9 to 42.0±5.1 nanometers, respectively. At a nitrogen gas flow rate of 5 sccm, the crystal structure exhibits a polycrystalline. All films showed the element composition with Cr as the predominant element. The hardness and modulus properties are also notably influenced by the change in nitrogen gas flow rates. At nitrogen gas flow rates between 0 and 3 sccm, the films exhibited average hardness values ranging from 10.4±0.8 to 11.8±0.4 GPa and average modulus values ranging from 145.7±13.7 to 157.3±5.8 GPa. These values were lower than those of the films deposited at a nitrogen gas flow rate of 5 sccm, where the average hardness is 14.7±0.8 GPa and the average modulus is 181.1±4.2 GPa. This demonstrated that when the crystal structure of the film was changed from amorphous to polycrystalline, the hardness and modulus values were increased.

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Published

2024-12-23

Issue

Section

บทความวิจัย (Research Article)