Effects of fouling formation in the cooling system of a central processing unit using Titanium Dioxide nanofluid
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Abstract
This research investigates the effects of fouling formation in the Cooling System of a CPU, divided into two main parts
to enhance the cooling efficiency of central processing units (CPU). The first part focuses on identifying the optimal
concentration of TiO2/water nanofluids (0.02 Vol.%, 0.05 Vol.%, 0.1 Vol.%, and 0.15 Vol.%) for reducing CPU
temperatures compared to water-based cooling and heat sink systems. The results indicate that a 0.05 Vol.%
concentration provides the best performance, reducing CPU temperatures by an average of 0.9 °C compared to
water and 15.9 °C compared to heat sinks. In the second part, the optimal concentration (0.05 Vol.%) was tested over
12 months to evaluate the effect of fouling on the system. The findings reveal that the cooling system maintains high
efficiency during the first five months but starts to degrade thereafter. CPU temperatures increased by an average of
1.1 °C due to fouling acting as a thermal insulator. This study highlights that TiO2/water nanofluids at a 0.05 Vol.%
concentration can significantly enhance cooling performance, with fluid replacement recommended every five months to sustain efficiency.
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References
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